Features:
Small size: The SOT23 package has a small size and is suitable for portable devices and miniature electronic products, such as smartphones, tablets, Bluetooth devices, etc.
Surface mount technology: SOT23 adopts surface mount technology (SMT), which simplifies the manufacturing process and helps improve production efficiency.
Thermal performance: The design of the SOT23 package usually allows the device to dissipate heat outside the package, which helps reduce temperature and improve device stability.
Symbol
| Dimensions in Millimeters |
| MIN. | MAX. |
A | 0.900 | 1.150
|
A1
| 0.000 | 0.100 |
| A2 | 0.900 | 1.050 |
b | 0.300 | 0.500 |
| c | 0.080 | 0.150 |
| D | 2.800 | 3.000 |
| E | 1.200 | 1.400 |
| E1 | 2.250 | 2.550 |
e
| 0.950TYP |
| e1 | 1.800 | 2.000 |
| L | 0.550REF |
| L1 | 0.300
| 0.500 |
| θ | 0° | 8° |
Notes:
1.All dimensions are in millimeters.
2. Tolerance ±0.10mm unless otherwise specified
3. Package body sizes exclude mold flash and gate burrs.
4. Dimension L is measured in gauge plane.
5. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
