
Concentrator carrier communication chips generate abundant harmonics (up to tens of MHz) during transmission, which can interfere with other circuits through power supply or spatial radiation. Eliminating harmonic interference requires source filtering and spectrum shaping. A combination of high-frequency decoupling capacitors (e.g., a 10μF tantalum capacitor + a 0.1μF ceramic capacitor + a 100pF ceramic capacitor) should be placed near the power supply pin of the carrier chip. A ferrite bead PBZ1005B-501Z0T should be connected in series on the carrier signal output line (TX), and a small capacitor (e.g., 47pF) should be connected in parallel to ground to form a low-pass filter, attenuating high-frequency harmonics. The carrier signal waveform should be optimized by using software configuration to make the rise/fall edges of the output waveform smooth (e.g., controlled within a few microseconds). The carrier circuit should be placed in a separate area on the PCB and surrounded by a ground plane. Tests show that these measures can reduce the carrier harmonic amplitude by more than 20dB, avoiding interference with the concentrator's own data acquisition and wireless communication.