How to optimize the return flow when copper plating is applied to the concentrator layer?

The copper pour strategy for the concentrator PCB directly impacts signal integrity and EMC. Optimizing return current is crucial for providing the shortest, continuous mirrored return path for each signal. Ensure that critical high-speed signal lines (such as clock and carrier signals) have a complete, unsegmented ground plane as a reference. If a signal needs to be layer-changed, a ground via should be placed next to the changeover to provide a path for return current. For analog circuit areas, copper pours should be continuous, avoiding excessive segmentation by power lines or isolation slots. If necessary, use 0Ω resistors or ferrite beads to bridge segmented areas. The ground plane for digital areas should be as complete as possible and connected to the inner ground plane using via arrays. For mixed-signal PCBs, a "unified ground plane" strategy can be used, where digital and analog sections share the same ground plane but are partitioned, connected only at one point below the ADC. Optimized ground plane copper pours can minimize signal return paths and reduce differential-mode radiation by more than 10dB.