How to reduce impedance when using a concentrator for high-frequency grounding?

High-frequency noise (above MHz) from concentrators requires an extremely low-impedance grounding path for effective discharge. The key to reducing high-frequency grounding impedance is minimizing inductance. Use large ground planes instead of thin traces. Provide localized grounding copper for critical chips (such as DC/DC converters and clocks) and connect them to the inner full ground plane via multiple vias (at least four per square centimeter). Use large-diameter grounding vias (e.g., 0.3mm) and place them as close as possible to the device's ground pins. Employ "multi-point grounding" for chassis grounding, connecting PCB grounding screw holes to the chassis at a spacing less than λ/10 (approximately 30cm for 100MHz) using toothed locking washers. Use flat braided grounding wires. Additionally, connect low-ESL ceramic capacitors (e.g., 1μF, 0402) in parallel between power ground and signal ground to provide a high-frequency short-circuit path. These methods can reduce grounding impedance in the 10MHz-100MHz band to below 0.1Ω, significantly improving high-frequency noise suppression.