
Crosstalk between the internal digital circuits (such as MCU and memory) and the analog acquisition and carrier communication circuits of the concentrator is mainly caused by harmonics at the edges of high-speed signals through common impedance and spatial coupling. Reducing crosstalk requires optimizing layout, filtering, and grounding. The PCB layout strictly adheres to partitioning: separating the digital area, analog area, and carrier area, with a ground plane isolation strip separating them. Critical high-speed lines (such as clock and address lines) use a stripline structure on the inner layers, with ground planes above and below. Small resistors (22Ω) or PBZ1005B-501Z0T ferrite beads are connected in series at digital I/O ports to mitigate edge interference. Independent LDOs are used for digital and analog power supplies, connected to ground at a single point via a CMZ2012A-900T common-mode inductor. The analog area is surrounded by a guard ring. Through simulation and actual measurement, the above methods can reduce digital noise interference to the 16-bit ADC to below 1 LSB and reduce internal system crosstalk by 30 dB.