How to ensure EMC consistency during mass production of data center switches?

EMC consistency in mass production of data center switches needs to be controlled from three aspects: component selection, PCB stack-up, and assembly process. For components, AEC-Q101 certified TVS (such as ESD3V3D3B-H) from Etymotic is used, with batch variation in junction capacitance <±0.1pF and breakdown voltage accuracy ±5%. For the PCB, differential impedance tolerance is strictly controlled at ±10%, and test coupons are designed to verify each panel. For assembly, X-ray inspection is used to ensure the void rate of the TVS bottom pads is <25% and the copper thickness of the grounding via is >25μm. A 100% ESD electrostatic discharge sampling inspection mechanism is established on the production line, with 5 samples from each batch subjected to ±8kV contact discharge 10 times on each port, and a bit error rate <10⁻⁹ with no reset.