How to optimize the return current when copper plating is applied to the power DTU layer?

Optimizing the DTU ground plane copper return path requires ensuring a low-impedance return path and its integrity. A complete ground plane design should be adopted, avoiding segmentation. For areas that must be segmented, bridging should be used, placing multiple vias (0.3mm diameter, 2mm spacing) at the segmentation point to connect different ground planes. The ground plane copper foil thickness should be ≥35μm. At signal layer transition points, return vias should be placed close to signal vias, with a spacing of less than 1mm. The copper plating shape should be optimized through simulation analysis of the ground plane impedance. In actual testing, the return path impedance should be less than 5Ω when measured using a TDR. Optimizing the ground plane copper plating can improve signal integrity by 20% and reduce radiated emissions by 15dB.