How should the power ground and signal ground of a power DTU be separated?

The separation of DTU power ground and signal ground must adhere to current path and noise isolation principles. On the PCB, high-current power grounds (such as power supplies and relays) should be physically separated from low-current signal grounds (such as ADCs and communication grounds) with a spacing greater than 2mm. A PBZ1608A-102Z0T ferrite bead or a 0Ω resistor should be used for single-point connection at the separation point, located at the power input point. The signal ground plane should remain intact to provide a clean reference for sensitive circuits. The power ground plane should be wide and thick to carry current. Ground noise coupling should be analyzed through simulation to optimize the separation shape. The measured ground noise voltage is less than 50mVpp. Proper separation can improve the system's anti-interference capability by 30%.