What problems can edge computing box EMC pre-testing detect in advance?

Edge computing box EMC pre-testing utilizes a spectrum analyzer, near-field probe, and current clamp to simulate standard tests during the R&D phase. This can identify the following issues in advance:

1. Location and frequency characteristics of major noise sources on the PCB board, such as 300MHz harmonics at DC-DC switching nodes;

2. Common-mode radiation intensity of interface cables and verification of the effectiveness of the common-mode choke CMZ2012A-900T;

3. Whether the insertion loss of the power filter is sufficient;

4. Resonant points and gap leakage in the shielding cavity;

5. Electrostatic discharge sensitive points. Although pre-testing is not standard, it can identify more than 90% of EMC risks. For the 30MHz spike found in the pre-test, PBZ1608E600Z0T ferrite beads can be added in advance or the Y capacitor value can be adjusted.

According to statistics from multiple edge box manufacturers, conducting pre-testing can increase the first-time pass rate of formal certification from 45% to 85%, significantly shortening the cycle.