Will the high-speed chips in edge boxes increase the difficulty of EMC rectification?

Edge computing boxes utilize high-speed chips such as CPU, DDR4, and PCIe Gen3, with signal rise times of <1ns, abundant harmonics up to the GHz band, and dense BGA chip packages, significantly increasing the complexity of PCB layer stacking and making rectification more difficult. Specific risks include: DDR4 clock speeds of 5400MHz; differential pair routing; impedance abrupt changes caused by reference plane segmentation; strong common-mode radiation; high-speed chip power supply transient currents; high dV/dt; requiring the placement of 0.1μF and 1μF high-frequency decoupling capacitors near each power pin, connected in series with PBZ1608E600Z0T ferrite beads (PB bead Z, standard 1608 size 1.6×0.8mm, E600 impedance 60Ω) to isolate power supply noise; additionally, a common-mode filter CMZ2012A-900T is needed for HDMI 2.0 TMDS signals to suppress high-frequency radiation. Therefore, edge boxes should undergo pre-compliance testing as early as possible, incorporating high-speed signal layout into EMC design to avoid significant later rectification costs.