
To pass ESD electrostatic discharge testing (such as IEC61000-4-2), EPS systems must establish an effective electrostatic discharge path and protect internal circuitry. Measures include:
1. Port protection: Install ESD protection devices at all accessible metal ports (such as housing seams, communication interface housings, and buttons) and signal ports that may be indirectly coupled. For example, use general-purpose protection diodes such as ESD5V0D3 for buttons and low-speed I/O ports; use low-capacitance ESD devices, such as ESDLC or ESDULC series, for high-speed data lines.
2. Low-impedance chassis grounding: The metal cabinet housing must be grounded with a thick conductor at low impedance to provide a direct and fast discharge path for ESD current, preventing charge accumulation and high voltage introduction into the interior.
3. Insulation and isolation: Ensure sufficient air gaps and creepage distances for non-metallic parts (such as circuitry behind plastic panels).
4. Internal circuit reinforcement: Add RC filters or small TVS diodes to critical pins of sensitive chips such as reset and interrupt pins; use shielded cables and ground the shielding layer.