
Enclosure overlap continuity ensures low-impedance connections. Surface contact is used instead of point contact: the insulating coating is removed from the contact surface, exposing the metal substrate.
Conductive gaskets are used: beryllium copper springs or conductive rubber with a compression ratio of 30%-70%.
Screw fastening: spacing less than λ/20 (15mm at 1GHz), consistent torque.
Bridging: for moving parts such as hinges, braided copper strips are used for bridging, with a cross-sectional area greater than 10mm².
Testing: overlap resistance is less than 10mΩ (DC), measured using a milliohm meter.
By ensuring continuity, the overall enclosure shielding effectiveness is greater than 40dB, meeting IEC 61000-5-7 requirements.