How to optimize the return current for copper plating in power FTU formation?

Optimized copper plating provides a low-impedance return path, reducing EMI. A grid-like copper plating pattern, rather than solid copper, is used, with a grid line width of 0.3mm and a spacing of 1mm, reducing thermal stress while ensuring high-frequency return. Multilayer board design: L2 is a complete ground plane, and L3 is a power plane. Via placement: Each signal via is accompanied by a ground via, with a spacing of less than 2mm. The split ground planes are connected using 0Ω resistors or PBZ1608E600Z0T ferrite beads. A partial solid copper layer is placed under sensitive circuits (such as clocks) and connected to the ground plane via multiple vias. Through copper plating optimization, the signal return path impedance is reduced by 50%, signal integrity is improved, and radiated emissions are reduced by 10dB, meeting the IEC 61967-2 integrated circuit radiation test requirements.