How to reduce EMI leakage using vias on a power FTU PCB?

Improper PCB via design can become EMI leakage antennas. Optimized solution: Signal via diameter 0.3mm, pad diameter 0.6mm, anti-pad diameter 1mm, providing a 50Ω characteristic impedance. Grounding vias are arranged around the signal via array with a 2mm spacing, forming a Faraday cage. High-speed signal vias use back-drilling technology to remove excess stubs. Power vias are arranged in multiple parallel connections to reduce inductance. The distance between vias and the board edge is greater than 3mm to prevent edge radiation. Through this optimization, EMI leakage caused by vias is reduced by more than 20dB, and the resonant frequency is moved out of the frequency band of concern, meeting the IEC 61967-2 integrated circuit radiation test requirements.