How to optimize the return path when copper plating is applied to EPS formations?

Optimizing the ground plane copper pour of EPSPCB is crucial for providing a low-impedance, controllable return path for high-frequency signals and noise currents. Optimization methods include:

1. Ensuring ground plane integrity: Avoid fragmenting the ground plane by signal lines, especially below high-frequency signal lines and sensitive analog areas; maintain a complete and continuous ground plane.

2. Providing a mirror plane for high-speed signals: Critical high-speed signal lines (such as clock and PWM drivers) must be placed on a signal layer adjacent to a complete ground reference plane. When changing signal layers, place ground vias nearby to provide return continuity.

3. Properly handling splits: If the ground plane must be split due to analog/digital ground splits, ensure no signal lines cross the split gap. For signals that must cross, use bridging or isolation solutions.

4. Dense ground vias: Place multiple ground vias at chip ground pins, decoupling capacitor ground terminals, and connector ground pins, connecting them to the main ground plane to reduce ground inductance.

5. Eliminating "islands": Inspect and connect any isolated copper traces that are not electrically connected to prevent them from becoming sources of radiation.