How to optimize the return flow when copper plating is applied to the PCS (Polymer Capacitor) layer of an energy storage system?

Optimizing the copper pour of the PCS PCB ground plane is fundamental to controlling EMI and ensuring signal integrity. The goal is to provide a continuous, low-impedance return path. Optimization methods include:

1. Integrity First: Avoid fragmenting the ground plane by signal lines as much as possible, ensuring the integrity of the ground plane, especially below high-frequency signal lines.

2. Provide a Mirror Plane for High-Frequency Signals: Critical high-speed signal lines (such as drive signals and clock signals) should run on layers with a complete ground reference plane. When signals change layers, place ground vias nearby to provide return continuity.

3. Splits and Stitching: If ground splits are necessary (such as modular ground splits), ensure that no signal lines cross the split gap. For multilayer boards, stitching capacitors or ferrite beads can be used to provide a high-frequency path at the split.

4. Multiple Via Connections: Connect chip ground pins and decoupling capacitor ground terminals to the internal ground plane through multiple vias to reduce ground inductance.

5. Avoid "Islands": Inspect and eliminate any unconnected isolated copper traces.