Will the heat dissipation design of industrial AI edge gateways in dusty environments affect AI computing power?

Industrial AI edge gateways used in dusty environments often employ fanless heat sinks or heat pipes. Dust accumulation in the heat dissipation holes and fin gaps leads to decreased heat dissipation efficiency, causing AI chips to throttle at high temperatures and reduce computing power. Solutions include:

1) using a closed casing for conductive heat dissipation and internally potting with thermally conductive adhesive;

2) installing washable dust filters on the heat dissipation holes and using positive pressure airflow walls;

3) selecting wide-temperature AI chips, such as those rated for -40℃ to -105℃, and using them at reduced capacity.

Simultaneously, the EMC filter inductor CML4532A-101T and the ferrite bead PBZ1608E600Z0T should be wide-temperature, low-loss types. A cement plant's actual test showed no AI computing power throttling after 6 months of operation.