
Eliminating crosstalk between traces within an I/O module PCB requires controlling the coupling mechanism. First, increase the spacing between parallel traces; the spacing should be at least three times the trace width. If spacing requirements cannot be met, inserting a grounded protective trace between two traces can effectively block electric field coupling. For multilayer boards, critical signal lines should be routed on layers with a complete ground or power plane as a reference, utilizing the plane for isolation. Reducing the distance between signal lines and the reference plane can enhance coupling and reduce crosstalk to adjacent lines.
Control the length of signal lines and reduce the length of parallel traces. For drivers that may generate crosstalk, a resistor can be connected in series at the output to slow the rise time, thereby reducing high-frequency components. For receivers, a small capacitor can be connected in parallel to ground to filter out coupled high-frequency noise. Using differential signals instead of single-ended signals provides stronger anti-crosstalk capability. Simulation tools can be used to predict crosstalk levels in advance, allowing for adjustments to routing strategies accordingly.