
To ensure the EMC performance stability of the motion controller (MC) under high and low temperature cycling and vibration environments, attention must be paid to component parameter drift and structural changes. Passive components with wide temperature ranges and stable temperature characteristics, such as X7R and C0G capacitors, should be selected. Conductive pads and shielding materials must maintain elasticity and conductivity under extreme temperatures. The dielectric constant of the PCB board should change minimally with temperature. Under vibration environments, ensure all electrical connections, especially grounding and shielding connections, are secure and reliable, preventing increased impedance or shielding failure due to vibration. Magnetic components in the filter should not generate noise or experience performance changes under vibration. EMC testing under high and low temperature cycling is required after design. Typically, samples are placed in a temperature chamber and, after stabilization, quickly moved to a test site for emission testing, or a remote monitoring system is used. EMC retesting should be conducted after vibration testing. Ensure the product's EMC performance still meets requirements under specified environmental stresses.