How to optimize the return current of the copper layer in the motion controller MC?

Optimizing the copper plating of the motion controller's (MC) ground plane to control the return current path requires ensuring a continuous and intact ground plane. Avoid signal lines dividing the ground plane to create long, narrow gaps, forcing return current to take a longer route. When signal lines change layers, place grounding vias next to their vias to provide the nearest return path for the return current. For high-speed signal lines, ensure there is a continuous ground plane reference underneath and control impedance consistency.

In mixed-signal areas, digital and analog grounds can be separated, but no other signal lines should cross below the separation gap. Arrange dense arrays of grounding vias around the board edges and connectors to form a "ground wall." Avoid creating isolated copper islands during copper plating; connect them to the main ground vias. For high-current areas, thicken the copper plating or add solder windows. Use simulation tools to visualize the return current path and ensure that the high-frequency return loop area is minimized. Verify the effectiveness of copper plating optimization by measuring ground noise and radiated emissions. Good copper plating design is the cornerstone of signal integrity and EMC.