
Optimizing the shortest path for high-speed signal lines in motion controllers (MCs) is crucial for reducing radiation and crosstalk. During PCB layout, prioritize high-speed components such as FPGAs, memory, and clock chips, placing them as close to each other as possible. Avoid long detours for high-speed signal lines, opting for direct point-to-point connections. When using automated routing tools, set strict length matching rules and topology constraints. For differential pairs, control both the total length and the intra-pair length difference.
In multilayer boards, minimize unnecessary vias and bends by strategically planning interlayer via placement. Utilize simulation tools to perform signal integrity analysis before and after layout, identifying and optimizing excessively long paths. For backplane systems, select connectors with appropriate pin distributions and optimize pin assignments to minimize high-speed signal traces. The ultimate goal is to minimize the physical length of all high-speed lines while meeting timing and impedance requirements, thereby reducing transmission delay, loss, and EMI risks.