How to design the power and signal spacing of the motion controller MC?

Designing safe spacing between power and signal traces in a motion controller (MC) is crucial to preventing coupling interference. On a PCB, power traces typically refer to high-current power supplies and motor drive lines; signal traces refer to low-speed analog, digital, and high-speed lines. The basic principle is that they should be laid out in separate areas. If they must be adjacent, the minimum spacing should be at least three times the trace width, and for high-voltage sections, creepage distance requirements must be met. Avoid long parallel traces; if unavoidable, insert a grounding shield in between.

Power traces should be placed on outer layers of the PCB for heat dissipation and wider placement, while signal traces should be preferentially placed on inner layers. In multilayer boards, use an intermediate ground plane to isolate the power and signal layers. For dv/dt lines of equal height to switching nodes, their length should be minimized and they should be kept away from sensitive signals. Verify the effectiveness of the spacing design by simulating coupling coefficients or measuring crosstalk. In system routing, power cables and signal cables should also be physically separated.