
In EPS layout, keeping high-frequency noise devices away from sensitive circuits is a direct and effective way to reduce spatial coupling interference. High-frequency devices include: switching transistors, fast recovery diodes, driver ICs, DC-DC converters, and high-speed digital circuits (such as DSPs and crystal oscillators). Sensitive circuits include: analog sampling operational amplifiers, ADCs, voltage references, PLL loops, and low-frequency control loops. Layout principles:
1. Zoned layout: Physically separate "noise zones" (power and digital sections) and "clean zones" (analog sections) on the PCB, leaving a buffer zone or using ground/isolation strips for isolation.
2. Follow signal flow: Layout according to power flow and signal flow direction to avoid placing sensitive circuits on the radiation path of high-frequency noise.
3. Increase distance: Utilize the principle of inverse square attenuation to maximize the distance between the two.
4. Shielding and isolation: If necessary, add shielding covers to noise devices or locally shield sensitive circuits (using shielding covers or grounded copper foil).
5. Pay attention to the vertical direction: In multilayer boards, avoid placing strong noise layers directly above or below sensitive circuit layers.