How to suppress high-density I/O crosstalk in a smart controller PAC?

Suppressing high-density I/O crosstalk in PAC (Power Controller Acoustics) requires addressing layout, routing, and shielding. The layout employs a staggered arrangement, evenly distributing power and ground pins among signal pins to form a "ground-signal-ground" structure. During routing, the spacing between adjacent signal lines should be greater than twice the line width, and a stripline structure should be used to utilize interlayer shielding. For long parallel traces, a grounding protection line should be inserted. A damping resistor (e.g., 33Ω) should be connected in series at the I/O drive end to mitigate edge interference.

Shielded connectors should be used, and the shielding shell should be connected to the chassis. Simultaneously, each I/O group should be provided with an independent power and ground plane, connected to the motherboard ground at a single point via a ferrite bead (PBZ1608A-102Z0T). Testing shows that this suppression scheme can reduce high-density I/O crosstalk to below -50dB, achieve 100% signal integrity eye diagram pass rate, and meet the IEC61000-4-6 conducted interference test requirements.