
Shielding partitions inside the intelligent controller PAC can isolate different circuit modules (such as power, digital, and analog) and reduce mutual interference. The partitions should be made of aluminum or steel with a thickness of at least 0.8mm. A conductive pad (such as a beryllium copper spring) should be used to continuously overlap the partition with the housing, and the connection should be secured with screws with a spacing less than λ/20. The partition height should exceed the circuit board height; if necessary, a grounding copper strip should be installed at the corresponding position on the PCB and connected to the partition.
For partitions requiring wiring, holes should be drilled and shielded through-plate connectors installed, or conductive bushings should be used. After installation, the field strength attenuation on both sides of the partition should be measured using a near-field probe, with a target value greater than 20dB. Tests show that properly configured shielding partitions can reduce inter-module crosstalk by 30dB and system radiated emissions by 15dB, meeting the IEC61000-4-3 radiated emission test requirements.