Global
CN
Applications
Support
Support
With over a thousand cooperative customers and 17 years of service experience, we can provide you with everything from model selection to technical support
Development
Development
Our unyielding mission is to continuously innovate and lead the industry's progress.
News & Events
News & Events
We will share every little bit of our life with you at all times
About
About
Yinte Electronics integrates technology research and development, chip manufacturing, packaging and testing, sales, and service
Careers
Careers
Unleash potential together, shape a healthy future for humanity
Support
With over a thousand cooperative customers and 17 years of service experience, we can provide you with everything from model selection to technical support

How to solve the mutual interference between multiple modules of the intelligent controller PAC?

Time:2025-05-13 Views:7次
Share:

The mutual interference between multiple modules (such as CPU, DSP, FPGA, and I/O modules) within the intelligent controller PAC is mainly caused by power coupling, spatial radiation, and common impedance. The solution adopts partition isolation and filtering: each core module is configured with an independent power tree, and PWR series power inductors (such as PWR6045R6R8) and local LDOs are used for decoupling; PBZ2012E600Z0T ferrite beads (600Ω) are connected in series between the interface signal lines between modules, and π-type filter circuits are reserved; CMZ series common mode inductors (such as CMZ2012A-900T) are used for common mode isolation of the high-speed bus; structurally, modules are isolated by metal shielding partitions, and the partitions are connected to the chassis with low impedance; the common ground plane adopts a star connection to avoid current crossing; test verification shows that this solution can reduce crosstalk between modules within the PAC by more than 25dB, and the system can still pass the EN55032 Class A radiated emission test when running at full load;