How to optimize the return current when using copper plating in the power line carrier PLC?

Optimizing the copper plating of power line carrier PLCs requires ensuring a low-impedance return path and integrity. A complete ground plane design should be adopted, avoiding segmentation, especially under high-speed signal lines. For areas where segmentation is unavoidable, bridging should be used, placing multiple vias (0.3mm diameter, 2mm spacing) at the segmentation point to connect different ground planes. The copper foil thickness of the ground plane should be ≥35μm to reduce resistance. At signal layer transitions, return vias should be placed close to signal vias, with a spacing of less than 1mm, to provide the shortest return path. Ground plane impedance should be analyzed through simulation to optimize the copper plating shape, ensuring an impedance of less than 0.1Ω in the carrier frequency band. In actual testing, the return path impedance measured using a TDR should be less than 5Ω. Optimizing the copper plating can improve signal integrity by 20% and reduce radiated emissions by 15dB.