
For ESD electrostatic discharge testing, a low-impedance discharge path must be established. Ensure continuous conductivity at contact discharge points, using beryllium copper springs at seams. Add a metal shielding mesh to air discharge points.
Interface circuit protection: Use ESDSM712 for communication ports and SMBJ24CA for power ports.
PCB design: Keep sensitive circuits away from discharge points, with a spacing greater than 8mm.
Grounding system: Ground the chassis through a low-impedance path.
This design can pass IEC 61000-4-2 Level 3 testing (6kV for contact discharge, 8kV for air discharge).