How to reduce crosstalk in the internal circuitry of an intelligent low-voltage monitoring unit?

Internal circuit crosstalk reduction optimizes PCB layout and layer stack-up. A four-layer board structure is adopted: top layer for signals, inner layer 1 for ground, inner layer 2 for power, and bottom layer for signals. Sensitive analog and digital circuits are partitioned with a spacing greater than 8mm, isolated by a ground guard ring. Clock signal lines are grounded with a 0.15mm trace width and a spacing of 3 times the trace width from adjacent signal lines. Power layers are segmented, with digital and analog power supplies connected via a PBZ1608A-102Z0T ferrite bead. Critical signals use differential routing with impedance control at 100Ω. A 100nF + 1μF decoupling capacitor is placed near the IC power pin. This design reduces crosstalk by more than 20dB, improves signal integrity, and meets the IEC 61967-2 integrated circuit radiation test requirements.