How can the EMC of a multilayer PCS stack in an energy storage system be improved?

Properly planning the stack-up structure of a PCS multilayer board is one of the most cost-effective ways to improve system EMC performance. The core principle is to provide a complete return plane for signals and power decoupling. Optimized stack-up strategies include:

1. Signal layers adjacent to reference planes: Ensure that each high-speed signal layer is adjacent to a complete ground or power plane, providing a defined low-impedance return path for signals and acting as shielding.

2. Power-ground plane pairing: Place the main power and ground planes closely adjacent to each other, forming a natural parallel plate capacitor, providing excellent decoupling for high-frequency noise.

3. Symmetrical structure: Use a symmetrical stack-up design (such as Top-Gnd-Sig-Pwr-Pwr-Sig-Gnd-Bottom) to prevent board warping and balance electromagnetic field distribution.

4. Critical signal inner layer routing: Route the most sensitive or noisiest signal lines (such as clock and drive signals) on inner layers, using upper and lower reference planes for shielding. Avoid routing high-speed signals on outer layers unless there is a complete ground plane reference.