How can the via design of a PCS in an energy storage system reduce EMI leakage?

Improperly designed vias on a PCS PCB can become "antennas" for high-frequency EMI leakage. Key design considerations to reduce leakage include:

1. Controlling the number of vias: Minimize the use of vias on critical high-frequency paths (such as switching nodes and clock lines). When necessary, prioritize blind vias or back-drilling techniques to reduce residual vias.

2. Increasing return vias: Place one or more ground vias adjacent to each signal via, especially high-speed signal and power vias, to provide the shortest path for high-frequency return current and create local shielding.

3. Via array shielding: Arrange dense arrays of ground vias around noise sources (such as crystal oscillators and switching ICs) or along the board edge to create a "Faraday cage" effect, confining noise within the board.

4. Avoiding sensitive layer penetrations: Avoid having unrelated vias penetrating the reference plane directly below sensitive circuit areas, causing planar interruptions.

5. Filling and plugging vias: Filling and plugging critical vias with conductive material can improve EMI and heat dissipation.