
Steps are as follows:
Measurement and installation area constraints: Determine the three-dimensional dimensions (length × width × height) of the reserved physical space, considering the interference from surrounding components and heat dissipation requirements
Evaluate heat dissipation requirements: Calculate copper loss and magnetic loss heat generation based on the rated current, and prioritize packages with large heat dissipation areas (such as flat or open structures)
Reference package library volume benchmark: Chip inductor (e.g., 2520 package): Typical volume is approximately 5×5×5mm³, supporting medium current (3~8A)
Plug-in inductors (such as I-shaped or toroidal cores): larger in size (e.g., a Φ10×12mm plug-in can carry 20A+), but occupying more vertical space
Iterative design verification:
Select the magnetic core model (such as PQ, EE, or toroidal core) based on the volume limit, and calculate the maximum allowable coil layers and turns.
By utilizing finite element magnetic field simulation or vendor tools (such as Magnetics Designer), we can deduce whether the inductance and temperature rise meet the required standards.
Compromise and trade-off: Limited volume may require sacrificing inductance or adopting multi-stage filtering to compensate for high-frequency suppression capability