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How to deduce the maximum allowable volume of a common-mode inductor based on the PCB layout space?

Time:2025-12-30 Views:16次
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Steps are as follows:

 

Measurement and installation area constraints: Determine the three-dimensional dimensions (length × width × height) of the reserved physical space, considering the interference from surrounding components and heat dissipation requirements

 

Evaluate heat dissipation requirements: Calculate copper loss and magnetic loss heat generation based on the rated current, and prioritize packages with large heat dissipation areas (such as flat or open structures)

 

Reference package library volume benchmark: Chip inductor (e.g., 2520 package): Typical volume is approximately 5×5×5mm³, supporting medium current (3~8A)

 

Plug-in inductors (such as I-shaped or toroidal cores): larger in size (e.g., a Φ10×12mm plug-in can carry 20A+), but occupying more vertical space

 

Iterative design verification:

 

Select the magnetic core model (such as PQ, EE, or toroidal core) based on the volume limit, and calculate the maximum allowable coil layers and turns.

 

By utilizing finite element magnetic field simulation or vendor tools (such as Magnetics Designer), we can deduce whether the inductance and temperature rise meet the required standards.

 

Compromise and trade-off: Limited volume may require sacrificing inductance or adopting multi-stage filtering to compensate for high-frequency suppression capability

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When using common mode inductance in conjunction with differential mode inductance, how should the parameters of the two be matched?
2025-12-30
Common mode inductance suppresses common mode interference (symmetric interference between two wires to ground), while differential mode inductance suppresses differential mode interference (asymmetric interference between two wires). Parameter matching requires complementary frequency coverage: the effective suppression frequency band of common mode inductance (such as 1kHz-100MHz) and the differential mode inductance (such as 50Hz-10MHz) should overlap smoothly to avoid suppression blind spots. Generally, the resonant frequency of differential mode inductance is slightly higher than that of common mode inductance, covering low-frequency differential mode interference (such as power supply ripple). Impedance matching: the common mode impedance of common mode inductance should be much larger than the common mode impedance of the circuit (such as ≥10 times), and the differential mode impedance of differential mode inductance should be much larger than the differential mode impedance of the circuit to ensure effective attenuation of interference. Current compatibility: the rated current of differential mode inductance should match the operating current of the circuit (to avoid saturation), and the rated current of common mode inductance should consider the superposition of common mode current and differential mode current, with both requiring a 20%-50% margin. Core saturation characteristics: differential mode inductance should use a core with high saturation flux density (such as Sendust) to avoid saturation caused by high differential mode current; common mode inductance should use a core with high magnetic permeability (such as ferrite) to prioritize common mode suppression capability
When using multiple common mode inductors in series, how can we avoid the overlap of resonance points?
2025-12-30
The resonance of common-mode inductance is determined by its inductance (L) and parasitic capacitance (C, such as inter-winding capacitance), with the resonance frequency f0​=1/(2πLC​). When multiple stages are connected in series, if the resonance points are close, it can lead to a sharp decrease or even amplification of interference suppression in a certain frequency band. To avoid the overlap of resonance points, differentiated design methods are employed: by adjusting the parameters of each inductance (such as core material, number of turns, winding structure), the resonance points of each stage are staggered. For example, the front stage uses a high permeability core (such as manganese-zinc ferrite) to increase inductance and reduce resonance frequency; the rear stage uses a low permeability core (such as nickel-zinc ferrite) to decrease inductance and increase resonance frequency, ensuring that the resonance point spacing is ≥2 octaves. Introducing damping: connecting small resistors (such as 10-100Ω) between stages to consume resonance energy and suppress resonance peaks, without significantly affecting the common-mode impedance. Parasitic capacitance control: the rear stage inductance adopts layered winding or adds a shielding layer to reduce parasitic capacitance, shifting the resonance frequency to a higher frequency band and complementing the front stage