Compared to traditional packaging, how much improvement in vibration resistance does the molded packaging of common mode inductors offer? ​

Molded packaging solidifies the magnetic core, winding, and pins as a whole through materials such as epoxy resin, eliminating gaps and looseness between components. This results in a more uniform stress distribution during vibration, preventing winding disconnection, magnetic core fragmentation, or pin detachment caused by mechanical impact. The specific improvement level needs to be determined in conjunction with testing standards (such as IEC 60068-2-6). Typically, it can increase the tolerance to vibration acceleration (such as in the 10-2000Hz frequency band) by 2-5 times, reduce the amplitude at resonance points by 30%-70%, and is suitable for strong vibration environments such as automotive and industrial applications.