
Using multilayer PCBs is an effective way to improve the EMC performance of concentrators. A typical 4-layer board stack-up is recommended: Top (signal), GND (complete ground plane), PWR (segmented power plane), Bottom (signal). A 6-layer board can add two inner signal layers or a second ground plane. Key design considerations include: ensuring an uninterrupted ground plane as a return reference for all signals; segmenting power planes according to voltage values, maintaining sufficient spacing (>0.5mm) between different power domains; routing high-speed signal lines on inner layers (stripline structure) with ground planes above and below for optimal EMI control; wrapping critical signals such as clock signals with ground lines or routing them between two ground planes; placing a ring of ground vias around the board edges to form a shield; and isolating sensitive analog circuits and noisy digital circuits in different areas using ground planes. A well-designed 4-layer board can reduce radiated emissions by 10-15dB compared to a double-sided board, while also improving noise immunity.