
Grounding continuity of a data center switch chassis refers to the electrical connection impedance between metal components such as the front panel, side panels, bottom panel, and back panel.
Requirements: DC resistance between any two points <2.5mΩ, impedance <10mΩ at 100MHz.
Implementation methods: Use conductive foam with 30% compression at joints for contact resistance <5mΩ; use grounding braided tape for hinge structures; add toothed washers to screw connections to pierce the oxide layer; rivet spacing ≤50mm.
Actual test results: Before optimization, the DC resistance was 15mΩ, and radiation exceeded the standard by 8dB at 330MHz; after optimization, the resistance was 1.8mΩ, and radiation decreased by 16dB, passing the test.