How to minimize the grounding impedance of a power DTU?

Minimizing DTU grounding impedance requires the selection of highly conductive materials and optimized connection methods. The grounding conductor should be multi-strand tinned copper wire (cross-sectional area ≥ 2.5 mm²) with a length less than 30 cm. Connection points should be soldered or crimped, with a contact resistance of less than 1 mΩ. The PCB ground plane should use thick copper (2 oz) and connect multiple layers via an array of vias (0.3 mm diameter, 2 mm spacing). The system grounding should employ a star topology, with all ground wires converging at a central grounding point. During testing, a four-wire milliohmmeter should be used to measure the grounding resistance, with a target value less than 0.05 Ω. Minimizing grounding impedance can reduce ground noise by 20 dB and improve system stability.