How can the PCSEMC (Potentially Specific Energy Storage Mechanism) and temperature rise of an energy storage system be optimized in tandem?

EMC design and temperature rise (thermal design) of PCS are closely related and require coordinated optimization. On the one hand, EMC measures may increase temperature rise: magnetic components such as common-mode inductors and differential-mode inductors have copper and iron losses; buffer resistors and filter resistors directly generate heat dissipation; reducing ventilation holes to improve shielding increases the difficulty of heat dissipation. On the other hand, high temperatures affect EMC performance: the permeability of magnetic components (such as common-mode inductors) may change at high temperatures, affecting filtering characteristics; capacitor life and parameters change with temperature; increased junction temperature of devices may change their switching characteristics, affecting the noise spectrum.

Coordinated optimization methods:

1. Select low-loss core materials (such as low-loss ferrite) and inductors with low DCR.

2. Optimize buffer circuit parameters to balance peak suppression and loss reduction. 3. Select the optimal filtering and shielding scheme within the allowable temperature rise through simulation and testing. 4. Design efficient airflow to maximize heat dissipation efficiency while ensuring shielding.