How to reduce crosstalk in the internal circuitry of a power FTU?

Internal circuit crosstalk is mainly caused by improper PCB routing, resulting in coupling through parasitic capacitance and mutual inductance. The solution involves optimizing the PCB layout and layer stack-up design. A four-layer board structure is adopted: top layer for signals, inner layer 1 for ground, inner layer 2 for power, and bottom layer for signals. Sensitive analog and digital circuits are separated by a spacing greater than 10mm, isolated by a ground guard ring. Clock signal lines are grounded with a 0.2mm trace width and a spacing of 3 times the trace width from adjacent signal lines. Power layers are segmented, with digital and analog power supplies connected via a PBZ1608A-102Z0T ferrite bead. Critical signals such as the sampling ADC input use differential routing with an impedance control of 100Ω. A 100nF + 10μF decoupling capacitor is placed near the IC power pin. This design reduces crosstalk by more than 25dB, improves signal integrity, reduces rise time ringing to less than 5%, and meets the IEC 61967-2 integrated circuit radiation test requirements.