Does an excessively high grounding resistance on the BMS control board cause electrostatic discharge potential difference interference?

Excessive grounding resistance can cause severe potential difference interference during electrostatic discharge (ESD) events. When ESD current is discharged through a high-impedance grounding path, a significant transient voltage difference is generated. This voltage difference can damage devices bridging the two grounds, cause logic circuit malfunctions, and reduce the clamping effect of protective devices such as TVS switches. Therefore, it is essential to ensure that the impedance of the ESD discharge path is extremely low. This requires the use of short, wide grounding wires, multi-point grounding to the metal chassis, and ensuring good conductivity continuity of the chassis itself. The grounding pads of protective devices on the PCB should be connected to the ground plane over a large area. Low-impedance grounding is the cornerstone of effective ESD protection.