How to keep high-frequency components of frequency converters away from sensitive circuits

In inverter PCB layout, keeping high-frequency devices away from sensitive circuits is the most direct and effective way to reduce noise coupling. High-frequency devices include IGBT driver chips, switching power supply chips, clock crystals, etc.; sensitive circuits include analog sampling operational amplifiers, reference voltage sources, PLL phase-locked loops, communication receivers, etc. During layout, functional partitioning should be performed first, clearly defining high-frequency noise areas and sensitive quiet areas on the PCB. These two areas should be kept as far apart as possible, typically at least 2-3 cm. A complete ground plane or power plane can be used as an isolation strip, or even physical slots can be used (but the impact on the return path must be considered).

High-frequency devices should be placed as close to the board edge as possible or adjacent to the power section, while sensitive circuits should be placed in the center of the board or away from noise sources. Crystal oscillators must be strictly kept away from analog input pins and communication interfaces. If space constraints prevent this, local shielding must be used to individually shield the high-frequency devices or sensitive circuits, and the shield must be properly grounded. Furthermore, provide sensitive circuits with independent, clean power supplies and strengthen filtering at their power input. Through strict layout partitioning and isolation measures, and by utilizing the shielding materials and filtering schemes of Audiotech, the performance of sensitive circuits can be guaranteed to be unaffected by high-frequency noise to the greatest extent possible.