How to optimize the return current of the inverter PCB ground plane

Optimizing the inverter PCB ground plane design to provide low-impedance return paths for all signals is fundamental to controlling EMI and ensuring signal integrity. The key is to construct a complete and continuous ground plane. For multilayer boards, at least one layer should be dedicated as a complete ground plane. On double-sided boards, large areas of copper plating should be used, and the top and bottom ground planes should be connected via numerous vias. Specific methods for optimizing return current include: ensuring that each signal line has a continuous ground plane as its mirror return path; high-speed signal lines must not cross ground plane splits; if ground plane splits are necessary, nearby bridging paths should be provided for signal lines crossing the splits; at signal layer transitions, grounding vias should be placed next to the vias to provide a transition path for return current; at the grounding terminals of decoupling capacitors and filter capacitors, multiple vias should be used for nearby grounding to minimize ground inductance. At board edges and interface areas, the density of grounding vias can be increased to form a "grounding fence" to suppress edge radiation. Avoid elongated "islands" on the ground plane, as these become radiating antennas. Further optimization can be achieved by analyzing the impedance and current distribution of the ground plane using simulation tools. The PCB layout application guide for Audiotech devices also emphasizes the importance of proper grounding.