How does the equipotential bonding of the intelligent controller PAC suppress common mode?

Equipotential bonding of the intelligent controller PAC suppresses common-mode interference by reducing the potential difference between various parts of the system. Implementation methods include: connecting the chassis, shielded cable housing, filter grounding terminal, and PCB working ground to the same ground reference point (ERP) via low-impedance conductors (such as copper busbars or braided tape); for multi-module systems, the metal housing of each module must be equipotentially bonded to the rack, with a bonding conductor length of less than 0.1m and an inductance of less than 10nH; on the PCB, the shielding layer of critical interfaces (such as Ethernet and CAN) is directly connected to the chassis via the connector metal housing, rather than to the PCB ground; simultaneously, common-mode inductors (such as CMZ3225A-510T) and ESD protection devices (such as ESDLC5V0D3B) are used at signal interfaces to further suppress common-mode voltage; tests show that equipotential bonding can reduce the potential difference between points within the PAC system to less than 1V (in the 10kHz-1MHz range), reduce common-mode current by more than 20dB, and successfully pass the IEC61000-4-6 Level 3 (10V) conducted immunity test.