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The system grounding improves immunity using a hierarchical grounding architecture. The first level is chassis grounding; the second level is power grounding; and the third level is signal grounding. A star topology is used for the grounding wires. In the PCB design: analog ground uses a single-point star grounding; digital ground uses a copper grid; the two are connected via ferrite beads. Both ends of the cable shielding are grounded. This system grounding improves common-mode immunity by 25dB, meeting the IEC 61000-4-6 10V conducted immunity and IEC 61000-4-4 2kV EFT test requirements.
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