
Terminal area wiring optimization reduces interface EMI. A zoned layout is adopted: power terminals, communication terminals, and sampling terminals are placed separately with a spacing greater than 10mm. PCB design: TVS protection is added to terminal pins, such as SMBJ24CA for power terminals and ESDSM712 for communication terminals. Filtering circuits are placed close to the terminals; for example, the common-mode inductor CMZ3225A-501T is less than 8mm from the terminal. Wiring uses a radial pattern. Grounding terminals use a star connection. Through optimization, radiated emissions from the terminal area are reduced by 8dB, and the electrostatic discharge immunity meets IEC 61000-4-2 Level 3 (6kV contact discharge).