How can common mode inductance in smart home devices balance cost and EMC performance? ​

Material substitution: Shielding layer: Aluminum tape is used to replace copper tape, reducing costs by 30%-50%, but accepting a decrease in high-frequency shielding performance by about 10dB.

Core: Low-cost manganese-zinc ferrite (such as PC30) is selected to replace nanocrystalline, sacrificing some high-frequency performance but meeting CISPR25 Class 5 conduction limits.

Structure optimization: Compact packaging: 1206/0805 patch packaging is used to reduce PCB space occupation, and leakage inductance is reduced by optimizing the shape of the core (such as E-type).

Shared design: The same inductor is compatible with multiple interfaces (such as USB/HDMI), adapting to different signal rates by adjusting the number of winding turns, reducing mold-making costs.