How to optimize the return flow of copper plating in the formation of intelligent low-voltage monitoring units?

Copper plating optimization for return current employs a grid-like copper plating pattern. The grid line width is 0.25mm, and the spacing is 0.8mm. Multilayer board design: L2 is a complete ground plane. Via placement: Each signal via is accompanied by a ground via, with a spacing of less than 1.5mm. The split ground planes are connected using 0Ω resistors or PBZ1608E600Z0T ferrite beads. A localized solid copper layer is placed under sensitive circuitry. Through copper plating optimization, the signal return path impedance is reduced by 40%, signal integrity is improved, and radiated emissions are reduced by 8dB.