News & Events

SPD standards (IEC/TC37A and TC64) have been released IEC61643-1:1998/GB 18802.1-2002 Surge Protective Devices (SPDs) for Low Voltage Distribution Systems - Part 1: Performance Requirements and Test Methods IEC61643-12:2002/GB/T 18802.12-2006 Surge protectors for low voltage distribution systems Part 12: Selection and use guidelines IEC61643-21:2000/GB/T 18802.21-2004 Low voltage surge protectors Part 21 Surge protectors for telecommunications and signal networks - Performance requirements and test methods IEC61643-22:2004/QX/T 10.3-2007 Surge protectors Part 3: Principles for selection and use in electronic system signal networks IEC60364-5-534:2002/GB 16895.22-2004 Electrical installations of buildings Part 5-53-534: Overvoltage protection appliances IEC61643-311:2001/GB/T18802.311-2007 Low Voltage Surge Protective Device Components Part 311: Gas Discharge (GDT) Specification IEC61643-321:2001/GB/T18802.321-2007 Low voltage surge protective device components Part 321: Avalanche breakdown diode (ABD) specification IEC61643-331:2003/GB/T18802.331-2007 Low voltage surge protective device components Part 331: Specification for metal oxide varistors (MOVs) IEC61643-341:2001/GB/T18802.341-2007 Low Voltage Surge Protective Device Components Part 341: Specification for Surge Suppressing Thyristor (TSS) The technical standard for lightning protection engineering (TC81) has been released IEC61312-1:1995/GB/T19271.1-2003 Protection against Lightning Electromagnetic Pulse Part 1: General Principles (replaced by GB/T 21714) IEC61312-2:1999/GB/T19271.2-2005 Protection against lightning electromagnetic pulses - Part 2: Shielding, internal equipotential bonding and grounding of buildings (GB/T21714 substitute) IEC61312-3:2000/GB/T19271.3-2005 Protection against Lightning Electromagnetic Pulse Part 3: Requirements for Surge Protective Devices (replaced by GB/T21714) IEC61663-1:1999/GB/T19856.1-2005 Lightning protection communication lines Part 1: Optical cables (replaced by GB/T21714) IEC61663-2:2001/GB/T19856.2-2005 Lightning protection communication lines Part 2: Metal conductors (replaced by GB/T21714) IEC62305-1:2006/GB/T21714.1-2008 Lightning protection Part 1: General principles IEC62305-2:2006/GB/T21714.2-2008 Lightning Protection Part 2: Risk Management IEC62305-3:2006/GB/T21714.3-2008 Lightning Protection Part 3: Physical Damage and Life Hazards of Buildings IEC62305-4:2006/GB/T21714.4-2008 Lightning protection Part 4: Electrical and electronic systems inside buildings Other published testing standards and revised standards GB/T21431-2008 Technical Specification for Testing of Lightning Protection Devices in Buildings GB 50057-200: Effects of lightning strikes on humans and livestock GB XXX XXX -200 Technical Code for Lightning Protection of Ancient Buildings Code for Construction and Quality Acceptance of Lightning Protection Engineering for Buildings (GB xxxxxxxxx-200) MH/T4402-2006 Technical Specification for Civil Aviation Communication, Navigation and Surveillance Facilities

On March 6, 2020, the Ministry of Industry and Information Technology held a special meeting on accelerating the development of 5G, deeply studying and implementing the important speech of General Secretary Xi Jinping on promoting the accelerated development of 5G networks, listening to the progress, difficulties and suggestions of 5G work in basic telecommunications enterprises, studying and deploying new infrastructure construction such as 5G networks, and serving epidemic prevention and control and economic and social development work. Chen Zhaoxiong, Deputy Minister of Industry and Information Technology, attended the meeting. Ke Ruiwen, Chairman of China Telecom, Yang Jie, Chairman of China Mobile, Wang Xiaochu, Chairman of China Unicom, Tong Jilu, Chairman of China Tower, and Song Qizhu, Chairman of China Radio and Television, attended the meeting. Chen Zhaoxiong fully affirmed the contributions made by basic telecommunications enterprises during the epidemic prevention and control period in promoting the construction and application of 5G networks, strengthening communication service guarantees and communication big data support services for epidemic prevention and control, using new generation information and communication technology to assist in resuming work and production, and suspending classes and schools. Chen Zhaoxiong pointed out that 5G, as a key new infrastructure supporting the digital, networked, and intelligent transformation of the economy and society, not only plays a prominent role in assisting epidemic prevention and control, resumption of work and production, but also has enormous potential in stabilizing investment, promoting consumption, assisting upgrading, and cultivating new driving forces for economic development. We should focus on the complexity of the current situation of epidemic prevention and control and economic and social development, fully recognize the importance and urgency of accelerating the development of 5G, scientifically grasp the new situation and requirements faced by 5G development, and pragmatically promote the accelerated development of 5G. One is to accelerate network construction, coordinate epidemic prevention and control with resumption of work and production, conscientiously implement precise prevention and control requirements at different levels, and accelerate the pace of 5G network construction. The second is to deepen the integration of applications, enrich the application scenarios of 5G technology, develop a platform economy based on 5G, drive the development of industries such as 5G terminal equipment, and cultivate new economic growth points. The third is to strengthen the industrial ecosystem, enhance the coordinated development of upstream and downstream enterprises in the industrial chain, accelerate the research and development of key 5G core technologies, expand international cooperation and exchanges, and continuously improve the level of 5G security assurance. Before the meeting, Chen Zhaoxiong and his delegation conducted research on the support of China Telecom's 5G, big data, and information technology applications for epidemic prevention and control, as well as resumption of work and production. The meeting also studied the support services of communication big data for epidemic prevention and control, number portability, network security, and other related work. Comrades from the General Office of the Ministry of Industry and Information Technology, the Department of Information Technology Development, the Department of Information and Communication Development, the Information and Communication Management Bureau, the Network Security Management Bureau, and the China Academy of Information and Communications Technology participated. Information source: Ministry of Industry and Information Technology 5G involves audio products such as transient suppression diodes, ESD protection modules, and self recovery fuses

The Ministry of Industry and Information Technology has summoned Tesla regarding the "reduced allocation door" incident and ordered Tesla (Shanghai) Co., Ltd. to immediately rectify in accordance with the relevant provisions of the "Management Measures for the Access of Road Motor Vehicle Production Enterprises and Products". On March 2nd, some Tesla owners discovered that their domestically produced Model 3 used HW2.5 chips instead of the HW3.0 chip indicated on the environmental information accompanying the vehicle list. Due to the fact that the former is a lower level component, from the perspective of consumers, this is a downgrade behavior. Therefore, these car owners have successively complained to Tesla's official and 315 platform, causing Tesla to fall into the "downgrade door". On March 5th, Tesla CEO Musk responded to the "downgrade door" on Twitter, saying, "The car owners who complained did not actually order FSD. Perhaps they don't know that if FSD is ordered after the vehicle is delivered, the onboard computer can also be upgraded for free. ”Musk's evasive response has caused dissatisfaction among many consumers. As the incident escalated, the Ministry of Industry and Information Technology finally issued a notice of interview on the 10th and ordered rectification. According to insider sources, after the announcement of the interview, it was revealed that users who order the domestic Model 3, whether or not they choose to install FSD, will enjoy HW3.0 hardware. For users who will currently receive HW2.5, Tesla will decide whether to deliver the car first and upgrade the chip or cancel the order according to the owner's wishes. The SM8S33CA power interface cannot be reduced!

1. Basic concepts of electromagnetic compatibility https://v.youku.com/v_show/id_XNDU1NTQzMzgyMA==.html?spm=a2h0k.11417342.soresults.dtitle 2.1 Basic Concepts of Electromagnetic Compatibility (Part 1) https://v.youku.com/v_show/id_XNDU1NTQ0MTMwOA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 23~A 2.2 Basic Concepts of Electromagnetic Compatibility (II) https://v.youku.com/v_show/id_XNDU1NTQ0NTUzMg==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 24~A 3.1 Electromagnetic Compatibility Test Standards (ESD Electrostatic Test Standards) https://v.youku.com/v_show/id_XNDU1NTQ0OTYwMA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 22~A 3.2 Electromagnetic Compatibility Test Standard (EFT Electric Fast Pulse) https://v.youku.com/v_show/id_XNDU1NTQ1Mzg4MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 21~A 3.3 Electromagnetic Compatibility Test Standards (Surge Impulse Test) https://v.youku.com/v_show/id_XNDU1NTQ1NzY4MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 19~A 3.4 Electromagnetic compatibility test standards (RF field induction and darkroom) https://v.youku.com/v_show/id_XNDU1NTQ2Mzg2MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 20~A 4.1 Principles and Selection of Common EMS Components (Varistor 1) https://v.youku.com/v_show/id_XNDU1NjMxMDMwNA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5~A 4.1 Principles and Selection of Common EMS Components (Varistors II) https://v.youku.com/v_show/id_XNDU1NTQ3MDI3Ng==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 18~A 4.2 Principles and Selection of Common EMS Components (TVS Transient Suppressor Diode I) https://v.youku.com/v_show/id_XNDU1NTQ3NTQyMA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 19~A 4.2 Principles and Selection of Common EMS Components (TVS Transient Suppressor Diode II) https://v.youku.com/v_show/id_XNDU1NjM0MjEwMA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5~A 4.2 Principles and Selection of Common EMS Components (TVS Transient Suppressor Diode III) https://v.youku.com/v_show/id_XNDU1NjMyNDMwNA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5~A 4.3 Principles and Selection of Common EMS Components (TSS Semiconductor Discharge Tube I) https://v.youku.com/v_show/id_XNDU1NTgzNjU0MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 18~A 4.4 Principles and Selection of Common EMS Components (GDT Gas Discharge Tube I) https://v.youku.com/v_show/id_XNDU1NTg0MDE2OA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 17~A 4.4 Principles and Selection of Common EMS Components (GDT Gas Discharge Tube II) https://v.youku.com/v_show/id_XNDU1NTk2MjE2NA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 16~A 4.5 Principles and Selection of Common EMS Components (OVP Overvoltage Protection Module) https://v.youku.com/v_show/id_XNDU1NTk2ODg0OA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 15~A 4.6 Principles and Selection of Common EMS Components (NTC Thermistors) https://v.youku.com/v_show/id_XNDU1NjMxNDg0OA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 3~A 4.7 Principles and Selection of Common EMS Components (PPTC Self Recovering Fuse I) https://v.youku.com/v_show/id_XNDU1NTk3NDk1Ng==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 13~A 4.7 Principles and Selection of Common EMS Components (PPTC Self Recovering Fuse II) https://v.youku.com/v_show/id_XNDU1NTk3OTkyMA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 14~A 5.1 EMS Surge Protection Circuit Recommendations (Part 1) https://v.youku.com/v_show/id_XNDU1NTk4Mzg1Ng==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 12~A 5.1 EMS Surge Protection Circuit Recommendations (II) https://v.youku.com/v_show/id_XNDU1NTk4OTM0MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 11~A 5.1 EMS Surge Protection Circuit Recommendations (III) https://v.youku.com/v_show/id_XNDU1NTk5Nzg4MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 11~A 5.2 EMS Surge Protection Circuit Recommendations (Part 1) https://v.youku.com/v_show/id_XNDU1NjM1NTA2OA==.html 5.2 EMS Surge Protection Circuit Recommendations (II) https://v.youku.com/v_show/id_XNDU1NjM1NTA2OA==.html?spm=a2hcb.12675304.uerCenter.5 !2~5~5! 2~DL~DD~A&firsttime=222 5.3 ESD electrostatic protection circuit recommendation https://v.youku.com/v_show/id_XNDU1NjAwODg3Ng==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 9~A 5.4 Precautions for ESD Electrostatic Protection Circuit Design (Part 1) https://v.youku.com/v_show/id_XNDU1NjAxMTgzNg==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 9~A 5.4 Precautions for ESD Electrostatic Protection Circuit Design (II) https://v.youku.com/v_show/id_XNDU1NjAyMTA2MA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 8~A 5.5 Precautions for the Design of EFT Group Pulse Electrical Protection Circuit (Part 1) https://v.youku.com/v_show/id_XNDU1NjAyNTA0OA==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 8~A 5.5 Precautions for the Design of EFT Group Pulse Electrical Protection Circuit (II) https://v.youku.com/v_show/id_XNDU1NjAzMjAzNg==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 7~A Summary (EMC Electromagnetic Compatibility) https://v.youku.com/v_show/id_XNDU1NjAzOTM5Ng==.html?spm=a2hbt.13141534.app.5 ~5!2~5! 2~5~5~5! 2~5~5! 2~5! 2~5! 2~5~5! 6~A

Datang Microelectronics Technology Co., Ltd. www.dmt.com.cn Beijing China Electronics Huada Electronic Design Co., Ltd. www.hed.com.cn Beijing Tsinghua Tongfang Microelectronics Co., Ltd. www.tsinghuaic.com Beijing Automatic Testing Technology Research Institute www.bjtest.com.cn Beijing Huahong Integrated Circuit Design Co., Ltd.

According to the Korean Central Daily, Samsung Electro-Mechanics announced at the board meeting on December 12 that it would liquidate its Kunshan company in China, officially exiting the smartphone motherboard (HDI) business. It is understood that Kunshan Samsung Electro-Mechanics was registered and established in 2009, officially starting HDI mass production in June 2010, becoming the main production base for Samsung Electro-Mechanics' HDI. Since October this year, Samsung has transferred HDI equipment from the Busan factory to Vietnam. After moving to Vietnam, it only produces after-sales related products, gradually reducing scale until exit. Analysis believes that Samsung Electro-Mechanics decided to exit the HDI business due to the low-price strategy of Chinese manufacturers...

Korean media reported that the world's largest photoresist manufacturer, Japan's JSR, plans to establish an ArF photoresist production line in Cheongju, Korea, to supply Samsung Electronics. Japanese JSR is the world's largest photoresist manufacturer, accounting for 24% of the global market share. Due to Japan's export control policies, the Korean semiconductor industry, especially Samsung Electronics, is striving to promote the localization of semiconductor raw materials and diversify and stabilize supply. Naturally, JSR is unwilling to lose this huge market, so it promotes establishing production lines locally in Korea to circumvent export restrictions. ArF lithography is the main method for memory device production, photoresist...

According to People's Daily Online, at the 2019 World Digital Economy Conference and the 9th China Smart City and Intelligent Economy Expo, China Mobile Zhejiang Company jointly released the world's first robot integrated with a 5G communication module with Zhejiang Zhichang Robot Group in Ningbo, bringing revolutionary changes to industry scenarios such as smart manufacturing, Industry 4.0, digital enterprises, and future factories.
It is understood that Ningbo Mobile actively cooperated with Zhejiang Zhichang Robot Group, taking the lead in jointly completing the 5G module access for advanced manufacturing products such as arc welding robots, which is another major innovation achievement in the field of 5G smart manufacturing.

According to media reports: Since July, Japan has included photoresists below 193nm used by Samsung Electronics and SK Hynix in manufacturing new-generation main products — application processors (AP) or LSI system semiconductors in the export restriction list. This time, it intends to include photomask equipment and circuit boards below 245nm used in the production of current main products — D-RAM and NAND flash semiconductors of the two companies in the restriction list.
Therefore, the Korean semiconductor industry is worried, “Japan's export restrictions aim to strangle the Korean semiconductor industry...