News & Events

On June 17th, the 2nd China Nansha International Integrated Circuit Industry Forum (2023 IC NANSHA), organized by Xinmou Research, opened in Nansha, Guangzhou. According to the Daily Economic News, Professor Wei Shaojun from the School of Integrated Circuits at Tsinghua University attended the forum and delivered a speech The keynote speech on "Re globalization of the Semiconductor Industry".

Equipped with MediaTek's latest flagship chip, the Dimensity 9200+, its iQOO Neo8 Pro 1TB version has officially gone on sale and topped the Android phone performance chart in May, providing users with a high-performance flagship experience with large memory. But this should only be the beginning of flagship phone development this year. It is rumored that MediaTek will launch a flagship chip, the Dimensity 9300, after the Dimensity 9200+by the end of the year. This chip will focus on“ Full Nuclear Power” The CPU architecture not only rivals A17 in terms of performance, but also reduces power consumption by more than 50%

CMS: Camera Monitor System Automotive electronic rearview mirror refers to adding electronic devices to the rearview mirror of a car, replacing traditional flat rearview mirrors with cameras and displays, to achieve a wider field of view and high-definition image display. GB+15084

Recently, at the 2023 Zhongguancun Forum "Beijing (International) Third Generation Semiconductor Innovation and Development Forum", Xiang Libin, a member of the Party Group and Deputy Minister of the Ministry of Science and Technology, stated that third-generation semiconductors represented by silicon carbide and gallium nitride have excellent performance and huge markets in fields such as information and communication, rail transit, smart grids, and new energy vehicles. Overall, during the 13th Five Year Plan period, the issue of 'availability' of China's third-generation semiconductor products and related equipment has been basically resolved. During the 14th Five Year Plan period, the focus will be on addressing the issues of 'usability, ease of use' and sustainable innovation capabilities. Xiang Libin stated that the Ministry of Science and Technology will focus on key core technologies and major application directions, and will focus on breaking through technological bottlenecks in materials, devices, processes, and equipment. After years of effort, the global third-generation semiconductor industry is entering a period of rapid growth. Cao Jianlin, Chairman of the International Semiconductor Lighting Alliance and Director of the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance Steering Committee, stated that "wide bandgap semiconductors, represented by third-generation semiconductors, are widely used in upgrading new energy, transportation manufacturing industries, and optoelectronic application scenarios that meet the 'dual carbon' goal. They have become an important engine for promoting innovation and upgrading in many industries." Cao Jianlin analyzed that China's development of third-generation semiconductors has already laid the foundation for technological breakthroughs and industrial coordinated development. The precision manufacturing level and supporting capabilities related to semiconductors have rapidly improved, laying a solid foundation for the localization of related equipment. Gan Yong, an academician of the CAE Member and director of the National Advisory Committee of Experts on New Material Industry Development, said for example that based on the third-generation semiconductor materials and devices, they will lead the disruptive and innovative application of high-end power equipment and promote the development of traditional power grids to semiconductor power grids. The deep integration of new generation information technology and industrialization is accelerating, creating enormous space for the development of the integrated circuit industry. Shunyi District in Beijing has initially formed an industrial chain layout from equipment to materials, chips, modules, packaging and testing, and downstream applications, gathering more than 20 upstream and downstream enterprises such as Taike Tianrun, Guolian Wanzhong, and Ruineng Semiconductor. At the forum, six industrial projects including the second phase of Guolian Wanzhong Silicon Carbide Power Chip were signed, with an estimated total investment of nearly 1.8 billion yuan. The third-generation semiconductor industry also faces many "growing pains". For example, the original innovation and application-oriented basic research capabilities are weak, key equipment and raw materials are still highly dependent on imports, there are still risks to the security of the industrial and supply chains, there is a lack of open, complete, and advanced third-generation semiconductor R&D pilot platforms, and the industrial ecosystem has not yet been established. To this end, the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance and other joint initiatives have been launched, focusing on key market demands and promoting the application of "green chips" and "healthy chips" based on third-generation semiconductor materials in fields such as new energy vehicles, photovoltaic energy storage, and new displays; Focusing on collaborative innovation in the industrial chain, jointly forming innovation consortia, strengthening the construction of public technology service capabilities and standardization capabilities, forming a collaborative innovation situation of close cooperation between industry, academia, and research, connecting upstream and downstream chains, and promoting the symbiotic development of large, medium, and small enterprises. Wu Ling, Chairman of the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance, believes that on the one hand, it is necessary to promote demonstration applications, connect the industrial chain, improve product competitiveness and industry leadership; On the other hand, it is necessary to gather innovative elements, actively promote international scientific and technological exchanges and cooperation, and focus on strengthening deep cooperation with small and medium-sized enterprises and R&D teams with mature technologies.

According to reports, the national standard "Reference Architecture for Blockchain and Distributed Accounting Technology" (GB/T 42752-2023) has recently been officially released. This is the first national standard in the field of blockchain technology approved for publication in China.

The semiconductor industry policies and export controls, such as the US Chip and Science Act, are important economic and trade concerns for China, and also key issues raised by Minister Wang Wentao during his talks with the US.

According to foreign media reports, under pressure from the United States, China will launch a large-scale plan to support its semiconductor industry in order to achieve self-sufficiency in chips. Sources have revealed in detail China's next steps. According to foreign media reports on Tuesday (December 13th), three sources said that China is developing a support plan worth over 1 trillion yuan (143 billion US dollars) to support the development of the semiconductor industry. According to sources, this is one of the largest fiscal incentive plans planned by the Chinese government within the next five years, mainly to support domestic semiconductor production and research and development through subsidies and tax credits. The analyst said,

According to the report of the Nihon Keizai Shimbun on November 7, November 8 on the reference news website, the Expo being held in Shanghai, China has attracted large US semiconductor enterprises and manufacturing equipment giants to participate. The Biden administration's semiconductor restrictions on China are intensifying US China relations, but for businesses, China is an indispensable market for profit. Outside of the semiconductor industry, major American companies such as Microsoft, Dell, and Metaverse Platform have participated in the exhibition. While promoting their own metaverse technology, various companies are also committed to providing support for Chinese enterprises to expand into overseas markets. According to reports, the Biden administration has also requested its allies to align with China's semiconductor restrictions, but like American companies, European and Japanese companies have also benefited greatly from China. In addition to ASML Holdings from the Netherlands participating in the exhibition, Canon and Nikon from Japan also brought their own semiconductor manufacturing equipment. According to the report, the relevant person in charge of the American semiconductor manufacturing equipment giant Panlin Group, who participated in this year's CIIE, warmly introduced their company's achievements and product advantages in China to corporate clients who came to inquire at the booth on the 6th: "We have been committed to promoting breakthroughs in the new generation of semiconductor technology Another industry giant, Koley Corporation of the United States, also participated in this year's exhibition. Previously, it was reported that due to the US government's increased export restrictions on China, these two American companies have suspended technical support for some Chinese companies. However, according to the staff at the booth, as long as it does not involve cutting-edge technology, they can still conduct business in China. According to reports, the American semiconductor companies participating in this exhibition include AMD, Intel, Texas Instruments, etc. The main exhibits are automotive and network semiconductors, which have attracted the attention of many Chinese companies.

According to sources cited by The Wall Street Journal, TSMC is considering expanding its production capacity in Japan. According to sources, the Japanese government hopes that TSMC will expand beyond its already operational factories. At present, TSMC is studying feasibility and has not yet made an initial decision. Another source familiar with the matter said that TSMC will consider producing more advanced chips in Kyushu, Japan. Currently, TSMC is building a chip manufacturing plant in Kyushu, Japan. This multi billion dollar factory has received subsidies from the Japanese government. This factory was originally planned to mainly produce chips for mature processes of automobiles and sensors, with plans to ship them by the end of 2024. TSMC considers expanding its production capacity in Japan to produce advanced process semiconductors