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The PMS201208-4R7M0T maintains stable inductance under high ripple current while minimizing magnetic core loss through its metal composite molded structure. The ultra thin 0.8mm profile enables extremely compact PCB layouts without compromising thermal dissipation. Its optimized winding resistance reduces conduction loss and improves conversion efficiency. The molded magnetic core suppresses EMI and flux leakage, making it ideal for PMIC power stages, wearable electronics, IoT nodes, portable devices, and compact industrial controllers requiring high frequency energy storage in limited board height.
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