
High-speed data interfaces such as USB 3.0 and Camera Link are primary sources of EMI noise. The key to suppression lies in integrating targeted filtering and protection solutions within the signal path. It is essential to place ultra-low parasitic capacitance TVS diode arrays as close as possible to the interface connector, with a typical capacitance value below 0.5pF to minimize impact on high-speed signal edges. Concurrently, common mode chokes with excellent high-frequency characteristics, such as the CMZ2012A-900T series, should be used in series to effectively filter common-mode noise without introducing excessive signal loss. In PCB layout, protection devices, chokes, and connectors must be placed in close proximity to ensure interference is handled before entering the board, while strictly maintaining impedance continuity of the signal traces.